FEATURES

• SMTA SERIES / FOCUS ON: HDI/ADVANCED TECHNOLOGY
  Wafer-Level Packaging Today
  WLP represents one of the most exciting and innovative frontiers in the packaging industry.
  Thomas Goodman and Peter Elenius

• FOCUS ON BUSINESS
  The ODM Threat to EMS
  After winning the motherboard market, Asian-based original design manufacturers have set their sights on a new target—mobile phones.
  Bill Coker

• Optimizing Processes and Materials for Flip Chip Reliability
  Careful material selection can yield FC assemblies with better reliabilities than some surface-mount components.
  Karl-Friedrich Becker and Tom Adams

• The Resurgence of Cleaning
  Why are many high-quality assemblers making the move from no-clean back to cleaning?
  Andreas Muehlbauer, PhD, and Umut Tosun

• NEW SERIES! Case Study Corner
  Screen Printing Partners
  An electronics assembler and its supplier eliminated tombstoning and solder balling associated with lead-free processes.
  Georg Steiner and Stefan Jockumsen

• Laser Solutions for Soldering
  Non-contact selective soldering with high-power diode lasers.
  Tony Hoult

• Lead-Free Implications for Barcode Labels
  Some polyimide labels may withstand the new thermal requirements for lead-free electronics manufacturing.
  James Williams, PhD

PERSPECTIVES

• Editorial

• Letters

• On the Forefront
  Phil Zarrow

• ET Trends
  Dr. Ken Gilleo

• Ask Les
  Les Hymes

• Problem Solved
  Peter Bollinger and Jim Lamuraglia

DEPARTMENTS

Industry News
NETgain
APEX News
HDI/Advanced Technology
Market Watch
Europe Watch
NEW! The Fine Pitch
Assembly Insider
Ad Index
Classifieds
APEX Product Spotlight
Buyer's Guide Update

Cover artwork courtesy of Universal Instruments Corp., Binghamton, NY.