FEATURES

• FOCUS ON: HDI/ADVANCED TECHNOLOGY
  Optimizing Solder Paste for Wafer Bumping
  This investigation examines the variables of wafer bumping using solder paste printing techniques.
  Maureen Brown and Fritz Byle

• 2-D or 3-D Inspection: Do You Have to Choose?
  Flexibility in x-ray inspection combines 2-D real-time imaging with 3-D axial computed tomography.
  Dr. Udo E. Frank

• Reliable Solder Joints for 0201s
  A summary of the eutectic and lead-free solder reliability testing that has been performed while developing the 0201 process.
  David Geiger, Mei Wang, Dr. Dongkai Shangguan, Todd Castello and Fredrik Mattsson

• 2004 Buyer's Guide

PERSPECTIVES

• Editorial

• On the Forefront
  E. Jan Vardaman

• Standard Features
  Jack Crawford

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Cover design by Javier Longoria.