October 2004 Issue Print E-mail
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Thursday, 30 September 2004 19:00

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FEATURES

  • Fume Extraction
    Airing it Out
    Thanks to higher soldering temperatures and more aggressive fluxes, fumes from lead-free solders are more harmful than those of tin-lead. What precautions are you taking?
    Karl Schuepsthul

  • Business Opportunities
    The Remanufacturing Equation
    Remanufacturing - restoring products to a like-new condition - is a $50-billion market, and a source of new business for assemblers. A study of three tech products shows a potentially hefty market, at the right discount.
    Mark Knight and Jonathan D. Linton, Ph.D.

  • Pb-Free Solder Pots
    A Study of Lead-Free Hot Air Leveling
    Questions have arisen over copper dissolution into lead-free alloys, particularly the use of alloys that may require added solder pot maintenance. An investigation into controlling lead-free HAL, plus maintaining the pot and separating copper intermetallics.
    David Suraski

  • Texas Prototypes
    For NPI, Texas Prototypes Doesn't Mess Around
    From a quiet start as an NPI arm of a tier one EMS provider, Texas Prototypes has spun off and branched out, and its band of engineers provides everything from product launch to lifecycle management.
    Lisa Hamburg Bastin

  • Cover Story
    Controlling Pb-Free Processes through AOI
    Will AOI prove effective in identifying differences in the appearance of lead-free solder? To wit: does a billboarded chip look the same? What about an insufficient solder joint? A look at how lead-free PCBs impact in-line systems.
    Thorsten Niermeyer

  • Underfill Selection
    Preventing Voids in CSP and BGA Underfill Encapsulants
    In a CSP or BGA underfill process, several potential sources of voids exist. Sidestepping voids starts with picking the right material, be it the paste or the underfill.
    Karl Loh and Edward Ibe

PERSPECTIVES

  • Caveat Lector
    New models for old problems.
    Mike Buetow

  • On the Forefront
    Why your area array could use a good colonoscopy.
    Dr. H.J. Zapfardt

  • Talking Heads
    IMI's Arthur Tam.
    Mike Buetow

  • EMS Insight
    "Why I bucked the outsourcing trend."
    Pamela J. Gordon, CMC

  • IPC Standards
    J-STD-001D and IPC-A-610D: A little closer.
    Jack Crawford

  • Problem Solved
    Considerations for shifting to high-mix without retooling an entire line.
    Peter Bollinger and Shawn Robinson

DEPARTMENTS

Industry News / Market Watch
Assembly Insider
Ad Index
Product Spotlight

On the cover: SEEING IS BELIEVING - Optimizing AOI for lead-free processes. (Photo courtesy Agilent Technologies)

Last Updated on Tuesday, 07 February 2012 09:49
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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Products

Techspray Introduces Fine-L-Kote High Viscosity AR Conformal Coating
Fine-L-Kote high viscosity AR acrylic conformal coating reportedly widens the process window and flexibility. Can use as-is for dipping or thin down for spray systems. Is for selective spray systems...