November 2012 Print E-mail
User Rating: / 1
PoorBest 
Written by Administrator   
Monday, 09 May 2011 00:00

November 2012 cover

 

FEATURES

    Advanced Packages
    Stepping Out With 0.4mm Pitch BGA/PoPs
    OEMs are finding the move from 0.5mm pitch BGA PoP to the next generation, 0.4mm ultra-fine pitch BGA PoP tough, indeed. These rules-of-thumb will help make the jump.
    by Syed W. Ali

    Associations
    The Mitchell Plan
    IPC's new president is wasting no time remaking the trade group in his own (attentive) image.
    by Mike Buetow

    ESD Basics
    You're Grounded!
    Setting up an ESD workstation or area to reduce the risk of electrostatic discharge in the workplace.
    by The ESD Association

    Reliability
    Electronics Failure Analysis for Pb- and Pb-Free Solder Joints
    Why the Weibull distribution is probably the most important distribution for solder material failure analysis.
    by Dr. Ron Lasky

    Tech Tips
    Manufacturing Cost Reduction through Automation
    A step-by-step process to cut costs for a high-rel RF tuner.
    by ACI Technologies

 

FIRST PERSON

 

MONEY MATTERS

  • ROI
    Restating value.
    Peter Bigelow


TECH TALK

Last Updated on Monday, 05 November 2012 04:47
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

Read more...
 
The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

Read more...
 

Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

Read more...
 
Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Yincae Rolls Out ACP120 Solderable Coating
ACP 120 series anti-oxidation solderable coatings replace nanofilm gold. Are for anti-corrosion and anti-rusting on solderable surfaces on which solder paste, solder preform or a solder ball can be...