June 2011 Print E-mail
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Monday, 09 May 2011 00:00

June 2011 cover

FEATURES

    Cover Story
    Benefits and Challenges of 3D Semiconductor Packaging
    By integrating multiple die elements within a single package outline, overall product functionality has increased and been made smaller than their predecessors, improving both performance and capability. Assembly of semiconductor die onto a substrate is essentially the same as those used for standard IC packaging in lead frames; however, substrate-based IC packaging for 3D applications can adopt a wider range of materials, and several alternative processes may be used in their assembly.
    by Vern Solberg

    Component Placement
    The Effect of Placement Yield on Rework Costs
    Calculating rework and scrap cost is relatively straightforward, provided the production line’s first-pass yield is known. Knowing how pick-and-place accuracy can impact post-assembly costs, however, can be an invaluable benchmark, as this study of cost as a function of various yield rates and line capacity shows.
    by Sjef van Gastel

    Inspection
    Using Automated SPI to Qualify SMT Stencil Suppliers
    The goal of stencil printing can be summed in one simple phrase: Get the right amount of solder paste in the right spot – every time. And the right stencil starts with the right supplier, but with all the options in metals, manufacturing processes, frame styles and price, selecting a stencil vendor can be a considerable task.
    by Chrys Shea


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Last Updated on Thursday, 09 June 2011 17:01
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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Products

KIC Debuts K2 Thermal Profiler
K2 thermal profiler has plug-and-play hardware and a graphical user interface said to make profiling both quick and easy. Enables each thermocouple to use its own unique process window, while...