March 2011 Print E-mail
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Friday, 07 January 2011 00:00

March 2011 cover

FEATURES

    Printing
    Impact of Mesh Size and Stencil Technology on Deposition Volume
    A study on the impact on solder volume deposition using Type 3, Type 4 and Type 5 SAC 305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils found that paste chemistry and rheology have a more profound effect on release than previously thought.
    by Karl Seelig and Tim O’Neill

    Reflow
    Practical Thermal Profile Expectations in a Dual-Lane, Dual-Speed Reflow Oven
    Now that we have the ability to run different speeds in each lane, recipes must be devised that satisfy both boards. Here, we discuss methods for obtaining such recipes.
    by Fred Dimock

    SPI
    Automated Solder Paste Inspection: A New Look at Stencils
    Many assemblers have foisted responsibility for automated inspection and verification onto the stencil vendors, referring to them as “qualified” or “certified” suppliers. In essence, they have placed the fox in charge of the henhouse on a portion of their most critical SMT process. While this practice might look good on paper, it’s rife with potential to backfire and ultimately cost more money than it saves.
    by Chrys Shea

    EMS Top 50
    The Great Rebound of 2010
    The electronics manufacturing industry will remember 2010 for many reasons: rampant component shortages (and the rise of counterfeits), the tight financial markets and tense end-market conditions. But mostly, it will be remembered for recovery.
    by Mike Buetow

     

FIRST PERSON

MONEY MATTERS

  • ROI
    Not so golden.
    Peter Bigelow


TECH TALK

Last Updated on Thursday, 10 March 2011 20:48
 

Columns

European RoHS Enforcement Explained

A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.

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Believing Foxconn Means Suspending Belief

The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down:

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Features

Managing Your ESD Program

The processes are as important as the tools.

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SMT Reflow Oven-to-Oven Repeatability

How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

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Products

Polyonics Introduces Double Coated Bonding Tapes
Ultra thin double coated tapes are for bonding and attaching components and assemblies where high dielectric strength is required. REACH and RoHS compatible. Come in polyimide (PI) and polyester...