Insufficient Solder Bottom-Side Fillets Print E-mail
User Rating: / 2
PoorBest 
Written by Paul Lotosky   
Tuesday, 02 June 2009 19:58

Wave Soldering TroubleshootingWhen these defects occur, check the flux and conveyor speed.

Last month, we discussed insufficient solder topside fillets. This month, we look at insufficient solder bottom-side fillets (Figure 1). Per IPC-A-610, an acceptable condition is a 100% solder fillet and circumferential wetting present on the secondary (solder source) side of the solder joint. The minimum acceptable condition is a 330° circumferential fillet and wetting present for Class 3 boards, and 270° for Class 1 and 2 boards.
Fig. 1

Primary process setup areas to check are:

  • Conveyor speed too slow.
  • Excessive time over preheat, causing the flux to be burned off.
  • Excessive dwell time, causing flux to be destroyed before exiting the wave.
  • Excessive bottom-side board temperature, causing flux to be burned off before the wave.
  • Insufficient flux or flux activity.
  • Wave height too low on one or both waves.
Other things to look for in the process:
  • Insufficient solder temperature.    
  • Excessive preheat.    
  • Excess flux blow-off.
  • Board not seated properly.    
  • Insufficient preheat.    
  • Insufficient flux blow-off.
  • Solder wave height too low.    
  • Contaminated flux.    
  • Flux not making contact.
  • Solder wave uneven.    
  • Flux SP GR too low.    
  • Conveyor speed high.
  • Solder contaminated.    
  • Flux SP GR too high.     
  • Flux applied unevenly.    

    
Other things to look for with the assembly:     

  • Board contamination.    
  • Improper board handling.    
  • Component contamination.
  • Component leads too short.
Other things to look for with the bare board:
  • Board oxidized.    
  • Mask in hole.     
  • Board warped.    
  • Board contaminated.    
  • Poor plating in the hole.    
  • Component contamination.
  • Misregistration of the mask.    
  • Hole and pad misregistered.

Other things to look for with the board design:

  • Poor pallet design.    
  • Internal ground plane.    
  • Pad size mismatched.
  • Large ground plane on component side.
  • Lead-to-hole ratio too large.     
  • Weight distribution.
  • Large ground plane on solder side.

Paul Lotosky is global director - customer technical support at Cookson Electronics (cooksonelectronics.com) This e-mail address is being protected from spambots. You need JavaScript enabled to view it .


blog comments powered by Disqus
Last Updated on Tuesday, 02 June 2009 20:16
 

Columns

Semblant Warms to New Fluoroolymer Conformal Coating

Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week.

Read more...
 
ECTC in Las Vegas

What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here.

This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31.

Read more...
 

Features

The Impact of Reel Splicing Kits on Setup and Changeover

Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way.

Read more...
 
Standard Solar Cells vs. Next-Gen Cells: Which is Winning?

Overcapacity is stalling the rate of improvement, but only for so long.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

GÖPEL Upgrades TOM AOI for Conformal Coatings
TOM system (Teachable Optical Measurement) inline AOI has been enhanced for inspection of conformal coating Maximum PCB size 460 x 400mm. Can be adjusted to specific test requirements. Range of...