May 2010 Issue Print E-mail
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Wednesday, 19 May 2010 08:56
May 2010 cover

 

FEATURES

  • Vapor Phase Rework
High Thermal Mass, Very High Lead Count SMT Connector Rework Process
Rigorous testing found local vapor phase clearly superior to alternative processes.
by Jim Bielick, Brian Chapman, Mitchell Ferrill, Michael Fisher, Phil Isaacs, Eddie Kobeda and Theron Lewis
  • Apex Recap
New Year, New Outlook
An uptick in attendance on the floor overshadowed a lack of innovations in the booths.
By Mike Buetow and Chelsey Drysdale

FIRST PERSON

EMS hot for LED.

Mike Buetow

FHP Reps’ Keith Favre.

Mike Buetow

Sayonara, electronics engineering?

Pete Waddell

 

MONEY MATTERS

Printed electronics: process revolution?

Randall Sherman

Bad grades.

Peter Bigelow 

 TECH TALK

Inside the iPad.

E. Jan Vardaman

Post-print inspection.

Dr. Rita Mohanty

Hot solder dip: back in vogue.

Al Cable

Implementing a reflow process.

ACI Technologies Inc.

Solder flooding.

Paul Lotosky

Toward grid parity.

Darren Brown

DEPARTMENTS

Last Updated on Thursday, 10 June 2010 15:21
 

Columns

What’s Driving Electronics Packaging and Assembly Trends?

Multi-die configurations and a switch to copper wires are rampant, and supercomputers are why.

Read more...
 
Bridging at Reflow

What causes it, and can it be eliminated?

Read more...
 

Features

Current Trends in Conformal Coatings

Custom formulations have become the norm.

Read more...
 
The Worldwide Industrial Electronics Assembly Markets Defined

Test, clean energy and process control represent huge potential for EMS.

Read more...
 

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Products

Corelis Releases ScanExpress v. 7.7 Boundary Scan Suite
ScanExpress version 7.7 boundary scan tool suite includes improved constraints handling, support for multi-core devices, and new JTAG Embedded Test support for additional Freescale and Texas...