• View the Digital Edition
  

FEATURES

• Process Improvement
  The DfM Continuum
  Design and manufacturing often are thought of as separate processes, with some interdependencies. But absent a feedback loop, development will be marred by unnecessary defects and re-spins.
  by John Isaac and Bruce Isbell
  

• Signal Integrity
  Open 'Eyes' in the Frequency Domain
  Although final performance is measured in the time domain, a detour may be the faster route to a signal integrity solution.
  by Dr. Eric Bogatin
  

• Screen Printing
  Divining Value in Screen Printer Ownership
  The purchase price of a capital item is only one element of value, but it can be one that is disproportionately influential in the purchase decision. A look at how some companies are matching equipment requirements with new ways to evaluate cost-of-ownership.
  by Trevor Warren
  

• Screen Printing
  Why Mixed Signal Calls for Precise Stencils
  Stencil accuracy has a direct bearing on the correct thermal profile.
  by Zulki Khan
  

• Materials Engineering
  Heat Transfer in LED Assembly
  LEDs may seem cool to the touch, but they all produce heat. So while they offer significant benefits over filament and fluorescent lighting, dissipating heat within an LED assembly involves the selection and use of thermally conductive and (usually) electrically insulating materials.
  by Chuck Neve
  

• Service Excellence
  The Big Mack Attack
  For two years running, Mack Technologies has taken home top honors in Circuits Assembly's Service Excellence Awards. Its secret? A customer service strategy based on execution performance and using data, derived through open and honest communication with customers, to drive improvements in performance.
  by Mike Buetow
  

FIRST PERSON

• Caveat Lector
  Toyota's painful lesson.
  Mike Buetow

• Sherman's Market
  No more dips for chips.
  Sandra Winkler

• Database
  Back to school.
  Pete Waddell

MONEY MATTERS

• ROI
  Fixing process improvement.
  Peter Bigelow

• Focus on Business
  Improve workers' lives, improve the bottom line.
  Susan Mucha

TECH TALK

• Real World EMC
  Designing out radiated emissions.
  Dr. Eric Bogatin

• Final Finishes
  Process flow and routine analysis.
  Lenora Toscano

• Screen Printing
  Maintaining the printer.
  Clive Ashmore

• Selective Soldering
  Hot for preheat.
  Alan Cable

• Tech Tips
  Corrosion mitigation.
  ACI Technologies Inc.

• Test and Inspection
  Machine programming.
  Tan Beng Chye

• Getting Lean
  Balancing tradeoffs of waste elimination.
  Ryan Wooten

• Wave Soldering Troubleshooting
  Lifted parts.
  Paul Lotosky

• The Defects Database
  Undissolved fluxes under low-standoff parts.
  Dr. Davide Di Maio

• Technical Abstracts
  In case you missed it.
  

DEPARTMENTS

Off the Shelf