January 2010 Issue Print E-mail
User Rating: / 0
PoorBest 
Friday, 01 January 2010 00:00

Circuits Assembly January 2010 cover

FEATURES

  • Productronica Recap
    Trading Up
    For the first time in 10 years, we saw the sun in Munich. Is it a sign of a new dawn for the industry? OK, no, but amid tepid expectations, Productronica turned out stronger than expected, again defying gravity and the pundits to remain the mother of all trade shows.
    by Mike Buetow

  • CAM
    Improving Fabrication Yields
    A large portion of manufacturing yield is tied up in the CAM process, and these "fabrication planners" can make the difference between profits and losses. Plus: The designer's role.
    by Zulki Khan

  • X-Ray Inspection
    X-Ray Imaging of Pb-Free Solder Joints
    Inspecting Pb-free solder joints requires consideration be given to the implications of the material differences exhibited by the elements present to ensure that optimal image quality is maintained. When optimizing the tube, the actual adjustments are highly dependent on the thickness and mass of the solder joint for various components.
    by Dr. Evstatin Krastev

FIRST PERSON

MONEY MATTERS

TECH TALK


DEPARTMENTS

Off the Shelf

Last Updated on Thursday, 07 January 2010 16:54
 

Columns

What’s Driving Electronics Packaging and Assembly Trends?

Multi-die configurations and a switch to copper wires are rampant, and supercomputers are why.

Read more...
 
Bridging at Reflow

What causes it, and can it be eliminated?

Read more...
 

Features

Current Trends in Conformal Coatings

Custom formulations have become the norm.

Read more...
 
The Worldwide Industrial Electronics Assembly Markets Defined

Test, clean energy and process control represent huge potential for EMS.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Corelis Releases ScanExpress v. 7.7 Boundary Scan Suite
ScanExpress version 7.7 boundary scan tool suite includes improved constraints handling, support for multi-core devices, and new JTAG Embedded Test support for additional Freescale and Texas...