November 2010 Print E-mail
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Monday, 11 January 2010 00:00

November 2010 cover

FEATURES

    PCB WEST RECAP
    Hot in the Valley
    Something isn’t getting through, as signal integrity classes were packed even though most designers say they don’t perform the critical analysis.
    by Mike Buetow

    POPCORN PREVENTION
    MSD Protection Steps Per J-STD-033B.1
    ICs can act like a sponge. If they have semi-permeable membranes, moisture from the ambient air can get into those devices. When they get rapidly heated during reflow or rework, the result is rapid outgassing. In some cases, this excessive outgassing causes popcorning, which can damage the internal structures of a component. This how-to helps prevent and rid moisture from components.
    by Don Shell

     

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Last Updated on Monday, 01 November 2010 15:17
 

Columns

European RoHS Enforcement Explained

A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.

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Believing Foxconn Means Suspending Belief

The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down:

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Features

Managing Your ESD Program

The processes are as important as the tools.

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SMT Reflow Oven-to-Oven Repeatability

How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

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Products

Alpha Introduces Lumet LED Materials
Lumet LED materials are for die attach and package, package on board, Luminaire module, power driver/supply and control systems. Lumet P33 Pb-free, no-clean solder paste for LED package-on-board...