September 2010 Print E-mail
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Written by Rebekah Just   
Tuesday, 10 August 2010 00:00

September 2010 cover

FEATURES

    Documentation
    Automating the Documentation Process
    “Documentation is much bigger than just design, fab and assembly,” experts say. A look at best-in-class processes that reduce the amount of time spent on drawings and notes by creating a “living” document.
    by Mike Buetow

    DfM
    Best Practices for Double-Sided Mixed-Technology Boards
    Plated through-hole assembly remains in use for some heavy power connectors, transformers and other devices where strong mechanical bonds are required. Reason: Heavy parts are prone to falling off during soldering.
    by George Henning

    COVER STORY
    A Critique of IPC-A-610E
    The industry standard for visual acceptance criteria for post-assembly soldering and mechanical assembly requirements has been revised. A master trainer assesses the revised guidelines, looking at the many changes to package-on-package and leadless device packages, flex circuits, board-in-board connections and newer style SMT terminations.
    by Bob Wettermann

    Solder Materials
    Present and Future Solder Technologies
    Next-gen product relies on advanced powder technologies, better flux formulations, and dual-function materials such as epoxy fluxes. How powders, activator chemistries and fluxes are evolving for production use.
    by Neil Poole, Ph.D., and Brian Toleno, Ph.D.

    SMT Cleaning
    Post-Reflow Residue Results Following pH-Neutral Cleaner Application
    A study of 40 leaded and Pb-free solders compares alkaline to pH-neutral cleaning agents.
    by Harald Wack, Ph.D., Joachim Becht, Ph.D., Michael McCutchen and Umut Tosun

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Last Updated on Wednesday, 13 October 2010 12:02
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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Products

Techspray Introduces Fine-L-Kote High Viscosity AR Conformal Coating
Fine-L-Kote high viscosity AR acrylic conformal coating reportedly widens the process window and flexibility. Can use as-is for dipping or thin down for spray systems. Is for selective spray systems...