| 2014 NPI Award Timeline |
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| Wednesday, 28 March 2012 00:00 | |||||||
Registration for the spring 2014 NPI Award program will open Sept. 5, 2013. Awards will be presented Mar. 25, 2014, at the IPC Apex Expo in Las Vegas. January 2014
The deadline for entries is Jan. 20, 2014. All entries must include product description (see requirements), corresponding digital image and payment to be considered. March 2014 The 2014 ceremony will take place Mar. 25, 2014, at the Mandalay Bay Convention Center on the trade show floor. May 2014 An article featuring the winners will be published in the May edition of CIRCUITS ASSEMBLY. There is also special advertising opportunities for winners. (Contact This e-mail address is being protected from spambots. You need JavaScript enabled to view it for advertising questions.)
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| Last Updated on Tuesday, 16 April 2013 12:58 |
Columns
| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
| Read more... |
| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
| Read more... |
Features
| Managing Your ESD Program |
The processes are as important as the tools. |
| Read more... |
| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
| Read more... |
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Inventec Releases SnBiAg Solder Paste
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...
