December 2009 Issue Print E-mail
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Tuesday, 01 December 2009 00:00

Circuits Assembly December 2009 cover

FEATURES

  • ATE Boards
    Processes for Building Test Boards
    Test load board assembly has unique nuances and quirks that most assemblers may not properly translate.
    by Marilyn Ta

  • KeyTronicEMS
    Of Mice and Men
    In the topsy-turvey world of electronics manufacturing services, KeyTronicEMS has turned 23 straight quarterly profits. For its unique but systematic approach to the EMS rollercoaster, and its stellar performance in all types of environments, KeyTronicEMS is our 2009 EMS Company of the Year.
    by Mike Buetow

  • Paste Deposition
    Optimizing Solder Paste Printing
    Counterintuitively, the trend analysis shows keep-out distance has little or no effect on paste transfer efficiency and height for 0402 and SOP type pads.
    by the iNEMI Solder Paste Deposition Group

  • Cover Story
    PoP Assembly Process Fundamentals
    Package stacking is proving ideal for a variety of applications requiring greater functionality, higher performance and a smaller footprint: Stacking pre-tested package sections enables a high degree of flexibility for designers, permitting virtually any combination of memory to be combined with any logic chipset.
    by Vern Solberg and Phil Damberg

  • Retrospective
    In Memoriam
    A look back at friends and colleagues who left us in 2009.
    by Mike Buetow

  • Circuits Assembly 2010 Buyers Guide

FIRST PERSON

  • Caveat Lector
    Productronica productive, foretelling.
    Mike Buetow

MONEY MATTERS

TECH TALK


DEPARTMENTS

Off the Shelf


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Last Updated on Monday, 28 December 2009 09:51
 

Columns

European RoHS Enforcement Explained

A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.

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Believing Foxconn Means Suspending Belief

The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down:

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Features

Managing Your ESD Program

The processes are as important as the tools.

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SMT Reflow Oven-to-Oven Repeatability

How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

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Products

Alpha Introduces Lumet LED Materials
Lumet LED materials are for die attach and package, package on board, Luminaire module, power driver/supply and control systems. Lumet P33 Pb-free, no-clean solder paste for LED package-on-board...