October 2009 Issue Print E-mail
User Rating: / 0
PoorBest 
Written by Administrator   
Thursday, 01 October 2009 00:00

Circuits Assembly October 2009 cover

FEATURES

FIRST PERSON

TECH TALK

  • Screen Printing
    Combining clamping and snugging in a single board handling method.
    Clive Ashmore
  • Reflow Soldering
    Larger pads and better PCB layout will reduce strain.
    Ursula Marquez de Tino, Ph.D. and Brian Roggeman
  • Wave Soldering Troubleshooting
    If solder isn’t reaching the components, check these areas.
    Paul Lotosky
  • The Defects Database
    What look like open BGA joints might be tricks of the light.
    Dr. Davide Di Maio
  • Process Doctor
    Chemistry cleaning trials should be conducted prior to equipment selection.
    Harald Wack, Ph.D.
  • Tech Tips
    Special software permits factory floor adjustments, potentially saving capital investments.
    ACI Technologies Inc.
  • Test and Inspection
    Five ICT tools for limited access testing.
    Andrew Tek
  • Solar Technologies
    The two primary ways need more repeatable accuracy.
    Darren Brown
  • Technical Abstracts
    In case you missed it.

DEPARTMENTS

Off the Shelf


blog comments powered by Disqus
Last Updated on Friday, 20 November 2009 18:32
 

Columns

What’s Driving Electronics Packaging and Assembly Trends?

Multi-die configurations and a switch to copper wires are rampant, and supercomputers are why.

Read more...
 
Bridging at Reflow

What causes it, and can it be eliminated?

Read more...
 

Features

Current Trends in Conformal Coatings

Custom formulations have become the norm.

Read more...
 
The Worldwide Industrial Electronics Assembly Markets Defined

Test, clean energy and process control represent huge potential for EMS.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Corelis Releases ScanExpress v. 7.7 Boundary Scan Suite
ScanExpress version 7.7 boundary scan tool suite includes improved constraints handling, support for multi-core devices, and new JTAG Embedded Test support for additional Freescale and Texas...