October 2009 Issue Print E-mail
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Thursday, 01 October 2009 00:00

Circuits Assembly October 2009 cover

FEATURES

FIRST PERSON

TECH TALK

  • Screen Printing
    Combining clamping and snugging in a single board handling method.
    Clive Ashmore
  • Reflow Soldering
    Larger pads and better PCB layout will reduce strain.
    Ursula Marquez de Tino, Ph.D. and Brian Roggeman
  • Wave Soldering Troubleshooting
    If solder isn’t reaching the components, check these areas.
    Paul Lotosky
  • The Defects Database
    What look like open BGA joints might be tricks of the light.
    Dr. Davide Di Maio
  • Process Doctor
    Chemistry cleaning trials should be conducted prior to equipment selection.
    Harald Wack, Ph.D.
  • Tech Tips
    Special software permits factory floor adjustments, potentially saving capital investments.
    ACI Technologies Inc.
  • Test and Inspection
    Five ICT tools for limited access testing.
    Andrew Tek
  • Solar Technologies
    The two primary ways need more repeatable accuracy.
    Darren Brown
  • Technical Abstracts
    In case you missed it.

DEPARTMENTS

Off the Shelf

Last Updated on Friday, 20 November 2009 18:32
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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Products

KIC Debuts K2 Thermal Profiler
K2 thermal profiler has plug-and-play hardware and a graphical user interface said to make profiling both quick and easy. Enables each thermocouple to use its own unique process window, while...