| April 2009 Issue |
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| Written by Administrator | |||
| Wednesday, 01 April 2009 08:50 | |||
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FEATURES
FIRST PERSON
MONEY MATTERS
TECH TALKScreen Printing Better Manufacturing Pb-Free Lessons Learned Reflow Soldering Test and Inspection Process Doctor Solar Technologies The Defects Database Wave Soldering Troubleshooting DEPARTMENTS
On the Cover: The next paradigm shift?
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| Last Updated on Thursday, 23 April 2009 13:54 |
Columns
| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
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| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
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Features
| Managing Your ESD Program |
The processes are as important as the tools. |
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| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
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Products
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...



