February 2009 Issue Print E-mail
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Written by Administrator   
Monday, 02 February 2009 09:53
February 2009 cover
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FEATURES

  • Cover Story
    Understanding IPC-9850
    To avoid misunderstandings, purchasers should compare the accuracy and DPMO specifications at the IPC reference speed, and should ask for reference speeds for their specific application, rather than just relying on raw IPC figures.
    By Sjef van Gastel

  • Top 50 EMS Companies
    The $50 Billion Club
    The gap between the Top 10 EMS companies and their smaller rivals is striking. But to make our exclusive list of the largest EMS companies in 2008 involves first reaching $200 million in sales.
    By Mike Buetow and Chelsey Drysdale

  • Test Developments
    The Changing Role of OEM Product Development Engineering Teams
    OEM engineering teams are being asked to do more with less on a regular basis. Result: Product development teams and suppliers see changes in the way they collaborate. A look at the types of changes likely to be driven by product development team downsizing and areas where a focused supply base can help fill the gaps.
    By Duane Benson

FIRST PERSON

  • Caveat Lector
    Let's call a spade a spade. Better yet, let's not call anything "low halogen.".
    Mike Buetow

MONEY MATTERS

  • Global Sourcing
    In the failed cases we see in our research, the cost of replacing a supplier far exceeds savings sought by the continuous cost reductions. OEMs start spending many dollars to chase pennies.
    Jennifer Read

TECH TALK

  • Screen Printing
    Like SMT many years ago, it appears embedded passives may be the industry's next leap of faith.
    Clive Ashmore

  • Reflow Soldering
    When solderability is causing defects, the use of nitrogen in reflow may be beneficial. For optimal cost-effectiveness, nitrogen should be applied only in the reflow areas.
    Ursula Marquez de Tino

  • Test and Inspection
    It is well documented that the farther up the production line a defect is found, the less expensive it will be to repair. These economic times leave no room for a $1 billion warranty extension.
    Stacy Kalisz Johnson

  • Tech Tips
    Excessive tarnish can inhibit flux effectiveness during manufacturing and may eventually lead to corrosion of the silver finish and underlying copper conductors.
    American Competitiveness Institute

DEPARTMENTS

Industry News
Market Watch
Product Spotlight
Ad Index
Assembly Insider

On the cover: IPC-9850 is a basic industry reference, but doesn’t tell the whole story.


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Last Updated on Tuesday, 05 May 2009 06:07
 

Columns

An Early Spring?

The second half of 2011 is behind us, literally and figuratively.

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‘An End-to-End Solution for Assembled HDI Rigid-Flex’

Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology.

MLFEX executive and PCD&F columnist Jay Desai spoke with editor-in-chief Mike Buetow about the new partnership.

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Features

SMT Stencils from a Production Perspective

Is the slew of new materials, coatings and processes truly unique, or just the same old hype?

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Implementing Good Test Coverage and Eliminating Escapes

Experimental data reveal a strong correlation between SPI and AXI.

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