| Gold from Green |
|
|
| Written by Mike Buetow | |||
| Monday, 29 June 2009 18:06 | |||
|
CA: How has Sanmina-SCI segmented or otherwise structured its internal AE units; is each a standalone, or are they integrated? SK: Our initial AE engagements started almost two years ago with customers in wind, energy and fuel cells. These were initiated through personal contacts, prior relationships, or the customer’s awareness of Sanmina-SCI’s end-to-end manufacturing capabilities, particularly in electromechanical engineering and manufacturing. Unlike some contract manufacturers that only do electronics assembly and box build, Sanmina-SCI also has core competencies in enclosures, machining, cables, and electromechanical design and assembly. This is a good fit for most of the AE market, which is why we have customers today in solar, wind, fuel cells and battery systems. Our current engagements in the AE business are more strategic, targeting AE growth sectors and customers who are a good fit for our total capabilities. We are supporting these sectors in an integrated manner through Sanmina-SCI’s component divisions, not through standalone internal AE units. CA: Have you found a way to leverage your traditional EMS business to capitalize on the AE market? SK: Yes, Sanmina-SCI has been able to leverage the traditional EMS services for AE customers in areas related to power electronics, control and distribution, meters and system integration. For example, we have been involved in manufacturing components like combiners, controllers and inverters, which are offered as an integral part of the AE solution by some customers. CA: Some analysts have noted a slowing in investments in the AE sector. Has Sanmina specifically seen this? SK: There does seem to be a slowdown in some markets, which has affected the AE activity, but it does not appear to be broad-based. CA: Does Sanmina see any specific IP inherent in AE production? If so, is the IP patent-worthy? SK: We do see some IP potential in areas that are not core or proprietary to our customers. CA: What have been some of the technical challenges of AE manufacturing? For example, wafer handling is not a traditional competency of assemblers. How has Sanmina tackled those challenges? Are the solutions driven by equipment sets or operator/engineering expertise? SK: We are not engaged in PV cell or module production at this time. The majority of engineering and manufacturing services we provide to AE customers support the Balance of System or Plant (BOS or BOP) needs. For example, Sanmina-SCI’s strengths in mechanical design and fabrication can be applied in optimizing BOS component processes and costs, which are key factors in the AE customer’s goal of achieving grid parity. Wafer handling, if needed, is not a major issue, since one of Sanmina-SCI’s divisions has been handling memory wafers for a few years. Ed.: Kamath will present on Sanmina-SCI’s AE strategy during SMTA International in October (stma.org/smtai).
|
|||
| Last Updated on Monday, 29 June 2009 18:13 |
Columns
| An Early Spring? |
The second half of 2011 is behind us, literally and figuratively. |
| Read more... |
| ‘An End-to-End Solution for Assembled HDI Rigid-Flex’ |
Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. |
| Read more... |
Features
| SMT Stencils from a Production Perspective |
Is the slew of new materials, coatings and processes truly unique, or just the same old hype? |
| Read more... |
| Implementing Good Test Coverage and Eliminating Escapes |
Experimental data reveal a strong correlation between SPI and AXI. |
| Read more... |
Products
These modular work benches offer quality and versatility for work areas that include network labs, assembly areas, shipping stations, security and command consoles, or as computer repair benches. Can...


