“Rising Opportunities for EMS Organizations in the Medical, Industrial, and Aerospace/Defense/Homeland Security”

Author: Charles W. Wade; This e-mail address is being protected from spambots. You need JavaScript enabled to view it

Abstract: The worldwide EMS industry is growing: a 12% annual rate over the next five years to $222 billion by 2011. Whereas EMS companies now produce 13% of the world’s electronics products, we project this capture rate of global Cost of Goods Sold to increase to more than 16% by 2011. Whereas larger EMS providers derive almost three-quarters of revenues from the computer, communications and consumer segments (EMS penetration of 16%, 25% and 10%, respectively), smaller companies serve a much more balanced market, such as industrial, medical and aerospace. Those latter segments are also increasingly receptive to outsourcing. These segments have a much lower current rate of outsourcing (2.5% to 6.9%) and, therefore, offer significant opportunities for contract manufacturers over the next five years. (Apex, April 2008)

“Thin Film Crack on the Top Die of a 2 Chip-On-Board (2COB) VFBGA Package”

Authors: C.W. Gee, E. Poh, K.W. Ting and S. Low

Abstract: Thin-film cracking was observed on the top die of a 2COB vfBGA package, post MST soak and 3X reflow. A detailed investigation revealed the presence of die bonding tape at the interface between the top die and mold compound initiated thin-film crack propagation from the die edge into the active circuit area, causing electrical failures. (IEEE International Reliability Physics Symposium, April 2008)


“Packaging Substrate Technologies Trend In Japan”

Author: Henry H. Utsunomiya; This e-mail address is being protected from spambots. You need JavaScript enabled to view it .

Abstract: Japan’s packaging substrate production in 2007 was an estimated $6.8 billion, more than 45% of the world’s total. System-in-package (SiP) and module boards with embedded active devices are in volume production in Japan, mostly for cellular phone applications. This is expected to expand to cellphone motherboards in the near future. For packaging substrates, three major embedded technologies are possible: embedded wafer-level, embedded bare die (e.g., flip chip), both of which are in volume production, and embedded bare die on other semiconductors with PWB and thin-film process (chip-on-chip). Flip-chip interconnects are forecast to drive packaging substrates, with minimum line widths reaching 5 µm and via diameters of 5 to 30 µm during the next five years. (SMTA Pan Pac Symposium, January 2008)

“Lean Kitting: A Case Study”

Authors: Ranko Vujosevic, Ph.D., Larry Hausman-Cohen, Jose A. Ramirez and Srinivasan Venkataraman; This e-mail address is being protected from spambots. You need JavaScript enabled to view it .

Abstract: This paper discusses kitting, describes ways to eliminate waste in different phases of kitting, and illustrates lean kitting using a case study conducted in a major EMS site. In general, the process recommended for electronics assembly plants: Dismantle central stockroom if currently in use. Abolish ERP system-based component procurement. Sign a contract with a single contractor that will supply all types of components used in the plant. Establish on-hand quantity for each component based on actual sales. Use an MES system to monitor component consumption and attrition. Provide daily component consumption data to component supplier, which restocks components once a week. Several component supermarkets are established on the shop floor (vertical carousels, if possible). Provide each supermarket area with an offline setup area for kitting and component and setup verification using the MES system. Maintain supermarkets for reels that stay on feeders at all times. Use MES system to maintain quantity of reels that stay on feeder per part number. Provide a Kanban setup area for each supermarket (offline setup area) where setup carts are delivered. Each assembly line is provided a maximum of three setups at a time: one on the line, one in Kanban area waiting for production, and one currently being kitted. MES system provides a kit-monitoring tool that permits plant-wide to view the status of each kit and Kanban content. After setup is completed, all parts (except reels that stay on feeders) are taken off the feeders and returned to the supermarket. (Apex, April 2008)

“Impact of IC Diffusion and Assembly Processes on Package Stress Induced Product Reliability Issues – An Insight into the Package Stress Relief Design Rules by Simulation”

Authors: Y. Li, M.A.J. van Gils, W.D. van Driel, R.B.R. van Silfhout, J. Bisschop, J.H.J. Janssen, G.Q. Zhang

Abstract: The chip layout and parameters of IC diffusion fab and assembly fab processes are taken into account in the simulations to study the impacts of those parameters on the packaging stress-induced damages, to evaluate the commonly used design rules and to find a systematic approach to the problem. (IEEE International Reliability Physics Symposium, April 2008)