July 2008 Issue Print E-mail
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Monday, 30 June 2008 19:00
July 2008 cover

FEATURES

  • Cover Story
    Will Electronics Follow the Sun?
    Those who invested in SMT in the early 1980s benefited from higher demand driven by the Internet, telecommunications and computing products. Those who do invest in alternative energies today might see the same results.
    By Irene Sterian

  • Emerging Technologies
    ‘Warm’ Manufacturing Heats Up
    Low-temperature or room temperature assembly has the potential to improve field reliability, streamline manufacturing and reduce cost.
    By Dr. Alan Rae, Dr. Andrew Skipor and Marc Chason

  • Domestic Production
    Reputation Trumps Recession, China
    Mid-tier EMS providers are alive and well, thanks to rising offshore logistics costs, inflation in China, quality concerns and a growing “Made in USA” fervor.
    By Art Rutledge

  • PWB Rework
    ‘Web Circuits’
    A major OEM has five boards with OSP finish requiring four additional components and the boards. Most companies would re-spin the design. But there’s a less expensive, more elegant solution.
    By Mike Buetow

  • Conformal Coatings
    A Novel Non-VOC Conformal Coating
    Moisture-cure coatings tend to be fast-reacting and could block dispensers. New chemistries, however, have led to a polyurethane pre-polymer, 100% solids material that performs well in SIR and thermal shock tests.
    By Jade Bridges

  • SEA Profile
    Krypton: Benchmarking Customer Satisfaction
    A newcomer to Circuits Assembly’s Service Excellence Awards, Krypton Solutions walked away with the highest overall customer rating for EMS providers with revenues less than $20 million. What drives the emerging EMS firm?
    By Chelsey Drysdale

  • 2008-09 Circuits Assembly Buyers Guide

FIRST PERSON

MONEY MATTERS

TECH TALK

DEPARTMENTS

Industry News
Market Watch
SMTA Int'l Product Preview
Ad Index
Assembly Insider

On the cover: Jumping into solar cells is expensive, but so was SMT in the 1980s. (Photos by Lucwa and Celestica)


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Last Updated on Friday, 01 August 2008 07:37
 

Columns

What’s Driving Electronics Packaging and Assembly Trends?

Multi-die configurations and a switch to copper wires are rampant, and supercomputers are why.

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Bridging at Reflow

What causes it, and can it be eliminated?

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Features

Current Trends in Conformal Coatings

Custom formulations have become the norm.

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The Worldwide Industrial Electronics Assembly Markets Defined

Test, clean energy and process control represent huge potential for EMS.

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