May 2008 Issue Print E-mail
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Written by Administrator   
Wednesday, 30 April 2008 07:35
May 2008 cover

FEATURES

  • Quality Control
    Eliminating Board Defects
    Quality product starts with DfA and the master drawing. But fabricators and assemblers have their place, too.
    By Zulki Khan

  • SEA and NPI Awards
    ‘Inspiration to Innovate’
    The 2008 edition of Circuits Assembly’s Service Excellence Awards was notable for the continuing dominance of Aegis as it was for the ascent of several previously under-the-radar EMS companies who made their mark for the first time. Plus: The NPI Award makes its debut.
    By Chelsey Drysdale

  • Cover Story
    Evaluating Manufacturability and Operational Costs for New Conformal Coating Processes
    Higher density components and smaller footprint layouts make the conformal coating process more challenging in terms of achieving acceptable first-pass process yields and cost-effective cycle times. This study of seven assembly process variables identified the three most critical variables and their impacts.
    By Jason Keeping

FIRST PERSON

MONEY MATTERS

TECH TALK

DEPARTMENTS

Industry News
Market Watch
Product Spotlight
Assembly Insider
Ad Index

On the cover: Novel test procedures and processes demonstrate that comparisons among various cleaning agents, masking materials, coating materials and application equipment can be made. (Photo courtesy Asymtek)


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Last Updated on Monday, 02 June 2008 09:51
 

Columns

What’s Driving Electronics Packaging and Assembly Trends?

Multi-die configurations and a switch to copper wires are rampant, and supercomputers are why.

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Bridging at Reflow

What causes it, and can it be eliminated?

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Features

Current Trends in Conformal Coatings

Custom formulations have become the norm.

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The Worldwide Industrial Electronics Assembly Markets Defined

Test, clean energy and process control represent huge potential for EMS.

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