January 2008 Issue Print E-mail
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Written by Administrator   
Tuesday, 01 January 2008 09:45
January 2008 cover

FEATURES

  • ESD Control
    Walking on Water
    Winter’s dry air means less humidity – and more static. High-pressure humidification systems can improve air quality and reduce energy costs.
    By Pierre Husson

  • Cover Story
    Flux Selection for Lead-Free Wave Soldering
    This design of experiments clarifies the best types, best available flux within each type, and process limits for each, and also discusses the gaps between the capability of existing flux chemistries and requirements of Pb-free assembly, industry standards and customer expectations.
    By Douglas Watson, Jasbir Bath and Pan Wei Chi

  • Component Inspection
    An A-to-Z Guide to X-Ray Inspection, Part II
    The second of a two-part article looks at practical recommendations for production sampling and viewing various part types.
    By Dr. David Bernard

  • Productronica Recap
    Evolution in Action
    At Productronica, the most radical sight was the transit strike. But the venerable show didn’t disappoint.
    By Mike Buetow

  • iNEMI’s Emerging Technologies
    Research Priorities for the Electronics Industry
    The merger of micro and nano, chemical, and other sensors with micro- and nano-electronics could mean disruption ahead.
    By Alan Rae, Ph.D., Robert C. Pfahl, Ph.D., and Charles Richardson

FIRST PERSON

  • Caveat Lector
    Sanmina-SCI: Poised for recovery?
    Mike Buetow

  • Talking Heads
    Syncro’s Ed Childress and why managing risk is essential to EMS companies.
    Mike Buetow

MONEY MATTERS

  • Focus on Business
    For EMS firms, finding the right trade show to reach customers is tricky business.
    Susan Mucha

TECH TALK

DEPARTMENTS

Industry News
Market Watch
Product Spotlight
Ad Index
Assembly Insider

On the cover: A DoE studies wave-soldered SMDs and through-hole parts. (Cover photo by Vladimir Sazonoff)


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Last Updated on Monday, 07 January 2008 08:55
 

Columns

What’s Driving Electronics Packaging and Assembly Trends?

Multi-die configurations and a switch to copper wires are rampant, and supercomputers are why.

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Bridging at Reflow

What causes it, and can it be eliminated?

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Features

Current Trends in Conformal Coatings

Custom formulations have become the norm.

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The Worldwide Industrial Electronics Assembly Markets Defined

Test, clean energy and process control represent huge potential for EMS.

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