| Henkel Opens Electronics Mold Compound Facility |
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| Thursday, 18 October 2007 05:46 | |||
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LIANYUNGANG, CHINA – Henkel Huawei Electronics Co., a joint venture of Huawei Electronics and Henkel Corp., announced plans to unveil its state-of-the-art mold compound manufacturing facility in Lianyungang, China on Oct. 26. The operation will encompass 16,000 sq. meters of administrative and manufacturing space and reportedly will have a production capacity of 25,000 tons of material annually. The site will be a central manufacturing hub, at which more than 10 patented epoxy mold compounds will be made, and will host product development, material prototype production, test and analysis and ongoing technology research. The JV’s mold compound materials are currently incorporated into discrete components, SOICs, QFPs, BGAs, CSPs and POPs.
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| Last Updated on Thursday, 18 October 2007 05:47 |
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