| Endicott Interconnect Wins Additional $19M in DoD Work |
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| Wednesday, 22 August 2007 05:10 | |||
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ENDICOTT, NY — The U.S. Department of Defense has increased an existing contract with Endicott Interconnect Technologies by $19 million to cover additional multichip module assemblies and equipment, the company reports. EI recently bought a flip-chip packaging line, including a screen printer, placement machines, reflow oven and AOI tools to build the additional MCMs.
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Columns
| An Early Spring? |
The second half of 2011 is behind us, literally and figuratively. |
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| ‘An End-to-End Solution for Assembled HDI Rigid-Flex’ |
Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. |
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Features
| SMT Stencils from a Production Perspective |
Is the slew of new materials, coatings and processes truly unique, or just the same old hype? |
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| Implementing Good Test Coverage and Eliminating Escapes |
Experimental data reveal a strong correlation between SPI and AXI. |
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Custom Products & Services Offers Work Benches
These modular work benches offer quality and versatility for work areas that include network labs, assembly areas, shipping stations, security and command consoles, or as computer repair benches. Can...
These modular work benches offer quality and versatility for work areas that include network labs, assembly areas, shipping stations, security and command consoles, or as computer repair benches. Can...
