| Abstracts Requested for Pan Pac Symposium |
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| Tuesday, 26 June 2007 05:11 | |||
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EDINA, MN – The Pan Pacific Symposium Technical Committee requests abstracts for the SMTA’s 13th annual Pan Pac Microelectronics event. The conference will be held at the Sheraton Kauai Resort, Jan. 22 – 24, 2008. The committee is looking for papers on packaging, interconnection, business issues, markets, assembly, and microsystems technology. The deadline for abstracts is July 20. Abstracts can be submitted online.
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Columns
| What’s Driving Electronics Packaging and Assembly Trends? |
Multi-die configurations and a switch to copper wires are rampant, and supercomputers are why. |
| Read more... |
| Bridging at Reflow |
What causes it, and can it be eliminated? |
| Read more... |
Features
| Current Trends in Conformal Coatings |
Custom formulations have become the norm. |
| Read more... |
| The Worldwide Industrial Electronics Assembly Markets Defined |
Test, clean energy and process control represent huge potential for EMS. |
| Read more... |
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