| Printed Electronics Study to be Presented in Chicago |
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| Monday, 25 June 2007 05:04 | |||
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CHEVY CHASE, MD – A trade group study examining opportunities for UV and electron beam technologies in printed electronics applications is nearing completion. An executive summary will be presented July 23 at a RadTech meeting in Chicago. RadTech is a trade association for companies interested in UV and EB technologies. Among the areas studied: conductive inks; RFID; displays; lighting; batteries; photovoltaics; circuitry; memory; sensors; clothing and textiles. The event is free, but advanced registration is required. Contact RadTech at This e-mail address is being protected from spambots. You need JavaScript enabled to view it .
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Columns
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| ‘An End-to-End Solution for Assembled HDI Rigid-Flex’ |
Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. |
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| Implementing Good Test Coverage and Eliminating Escapes |
Experimental data reveal a strong correlation between SPI and AXI. |
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Custom Products & Services Offers Work Benches
These modular work benches offer quality and versatility for work areas that include network labs, assembly areas, shipping stations, security and command consoles, or as computer repair benches. Can...
These modular work benches offer quality and versatility for work areas that include network labs, assembly areas, shipping stations, security and command consoles, or as computer repair benches. Can...
