| Intel to Host Technology Interchange in May |
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| Monday, 26 March 2007 05:25 | |||
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PORTLAND, OR – Intel Corp. invites suppliers to participate in a technology interchange in which the semiconductor company will share its vision and reveal its requirements for the supply chain. The event – Where Are We Going? Where Do We Need to Be? – will be held May 23 at the Holiday Inn Portland Airport. Intel general manager of systems manufacturing technology development Martin Rausch will keynote the event, speaking on The Inevitable Transition to HDI. Other topics to be discussed include underlying issues that must be overcome as the industry makes advances in package scaling and associated board density, and what needs to happen to create pull for HDI PCBs from the OEM and ODM communities. Nine industry suppliers will outline the supply chain's abilities and present gap analyses in the areas of lamination, cost-effective microvias, metallization/etching, embedded passives, board-level underfill solutions, component size and spacing reductions, assembly equipment, rework and alternative alloys. For more information, contact Susan Filz, This e-mail address is being protected from spambots. You need JavaScript enabled to view it . Registration form: http://www.ipc.org/3.0_Industry/3.5_Councils_Associations/3.5.0_IPC/3.5.0.1_Suppliers/intel-0507/intel0507-REG.pdf
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| ‘An End-to-End Solution for Assembled HDI Rigid-Flex’ |
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