ENDICOTT, NY – The U.S. Department of Defense has awarded Endicott Interconnect Technologies multiple contracts totaling $164 million to produce card frame assemblies, including organic semiconductor packaging, module assemblies, printed circuit boards and assemblies, and engineering services. The company did not specify what product the assemblies would be used for. EI recommended its HyperBGA organic substrate as an alternative to ceramic semiconductor packages, leading to the module assembly business and the initial $6.5 million award. Subsequent development and collaboration lead to additional technical scope for follow-on contracts, including PCB fabrication, complex board assembly and higher level integration into card frame subsystems. Contracts totaling $37.5 million product certification, which included build of the formal qualification parts and all related documentation, reporting, quality and reliability requirements. The remaining $120 million contract was awarded for the first production order of fully integrated card frame assemblies, to be delivered by year-end.