November 2007 Issue Print E-mail
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Wednesday, 31 October 2007 19:00

November 2007 cover

FEATURES

  • RoHS Transition
    Pb-Free Manufacturing from a Tier III EMS Perspective
    The Pb-free transition was daunting even for larger EMS firms, but had a major impact on smaller firms that lacked abundant engineering resources. How did we do it and how has the process matured? Here’s how one company made the switch.
    Greg Caswell

  • Standards Development
    ‘Living Documents, Subject to Change’
    The origins – and future – of standards, the foundation of electronics manufacturing.
    Michael L. Martell

  • Reflow Soldering
    Creating Ideal Solder Joints
    Reflow soldering is a superset of an accurate thermal profile. A poorly devised profile can have devastating (read: expensive) repercussions. Same goes for the stencil.
    Zulki Khan

  • Cover Story
    An Alternative Drying Process for MSDs
    Components baked at 70°C for 24 hr. in a vacuum passed IPC and EIA testing.
    Charles S. Leech Jr.

  • SEAs 2007
    ‘Customer Satisfaction is More than a Score’
    For five-time SEA winner DEK, it’s about continuous improvement, not the highest scores.
    Chelsey Drysdale

  • iNEMI Roadmap
    Optoelectronic Substrates: Will They Happen?
    Optoelectronic interconnects can provide increased bandwidth and other advantages for special applications over copper, but implementation has fizzled. What changes need to occur to make this mainstream?
    Jack Fisher

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On the cover: A novel solution to component moisture problems. (Photos by Kuzma and Li Kim)


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Last Updated on Saturday, 13 October 2012 08:16
 

Columns

European RoHS Enforcement Explained

A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.

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Believing Foxconn Means Suspending Belief

The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down:

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Features

Managing Your ESD Program

The processes are as important as the tools.

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SMT Reflow Oven-to-Oven Repeatability

How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

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Products

Inventec Releases SnBiAg Solder Paste
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...