| Abstracts Sought for SMTA Soldering Conference |
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| Thursday, 07 December 2006 09:26 | |||
TORONTO – SMTA is seeking papers for a conference on soldering and reliability to be held in Toronto this spring. To present a paper, submit a 200- to 300-word abstract. Suggested topics include SnPb with Pb-free components; reliability; harsh environment; tin whiskers; new alloys; electromigration; thermal dissipation; manufacturing process; supply chain issues; advanced packaging; new substrate materials; surface finishes; thermal interface materials, and underfill. The SMTA did not specify the precise dates of the conference. Abstracts are due Jan. 18 to Melissa Serres at
This e-mail address is being protected from spambots. You need JavaScript enabled to view it
. Include a title, author name and contact information. Authors will be notified of acceptance by Jan. 31. PowerPoint presentations are required and will be due March
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