| Pac Tech to Open Wafer Bumping Facility |
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| Thursday, 07 December 2006 04:52 | |||
PENANG, MALAYSIA – Pac Tech will open a high-volume wafer bumping facility in Penang next year. The 40,000 sq. ft. location will be completed in June and will be designed for mass production of wafer bumping using electroless NiAu, solder stencil printing, wafer sawing, solder-ball placement and more. The facility will reportedly be able to process 600,000 wafers annually to start. The company will begin producing in volume in October.
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Columns
| An Early Spring? |
The second half of 2011 is behind us, literally and figuratively. |
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| ‘An End-to-End Solution for Assembled HDI Rigid-Flex’ |
Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. |
| Read more... |
Features
| SMT Stencils from a Production Perspective |
Is the slew of new materials, coatings and processes truly unique, or just the same old hype? |
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| Implementing Good Test Coverage and Eliminating Escapes |
Experimental data reveal a strong correlation between SPI and AXI. |
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Custom Products & Services Offers Work Benches
These modular work benches offer quality and versatility for work areas that include network labs, assembly areas, shipping stations, security and command consoles, or as computer repair benches. Can...
These modular work benches offer quality and versatility for work areas that include network labs, assembly areas, shipping stations, security and command consoles, or as computer repair benches. Can...
