| Flextronics Licenses Tessera's Wafer-Level Assembly Technology |
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| Written by Mike Buetow | |||
| Thursday, 07 September 2006 05:27 | |||
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SAN JOSE – Flextronics will license Tessera's wafer-level assembly technology
under a just-signed deal, the companies said yesterday. No financial terms were announced. Under the terms of the agreement, Flextronics will use Tessera’s Shellcase CF technology in its entire camera module line. Shellcase CF is a wafer-level technology that uses the manufacturing infrastructure of conventional chip-on-board assembly processes, while resolving the challenges associated with increasing resolution and decreasing pixel size in image sensors. The technology is used to assemble optical components integrated into electronics products such as miniaturized cameras in camera phones, digital still cameras and video camcorders.
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