| Flip-Chip Substrate Supply Tight Through 2006 |
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| Written by Robin Norvell | |||
| Monday, 26 June 2006 06:50 | |||
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Austin, TX -- Increased demand in 2005 resulted in longer delivery times and price increases for laminate flip chip build-up substrates, according to market research firm TechSearch International. While several companies have since added capacity, the situation is expected to remain much the same through the end of this year. Installed capacity requires time for qualification before substrates can be shipped for production. Approximately 25 weeks are needed to complete incoming engineering evaluation (2 weeks), engineering build (8 weeks) and actual qualification testing (15 weeks). However, TechSearch notes that the situation should improve in 2007 and 2008 as additional capacity is installed and qualified. For its analysis, the firm interviewed two dozen laminate substrate suppliers to determine production capacity for build-up FC-PBGA, wire bond PBGA, and laminate CSP substrates.
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