| Pan Pac Calls for Papers |
|
|
| Written by Robin Norvell | |||
| Thursday, 22 June 2006 05:22 | |||
|
Minneapolis, MN -- The Surface Mount Technology Association (SMTA) is seeking abstracts for its Pan Pacific Symposium. The conference will be held in Maui on Jan. 30 – Feb. 1, 2007. Papers are sought in the following areas: Packaging Interconnection Business Issues Markets Assembly Microsystems Technology The deadline to submit an abstract is July 17. The full call for papers can be found at: smta.org/pan_pac/call_for_papers.cfm
|
Columns
| An Early Spring? |
The second half of 2011 is behind us, literally and figuratively. |
| Read more... |
| ‘An End-to-End Solution for Assembled HDI Rigid-Flex’ |
Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. |
| Read more... |
Features
| SMT Stencils from a Production Perspective |
Is the slew of new materials, coatings and processes truly unique, or just the same old hype? |
| Read more... |
| Implementing Good Test Coverage and Eliminating Escapes |
Experimental data reveal a strong correlation between SPI and AXI. |
| Read more... |
Products
Custom Products & Services Offers Work Benches
These modular work benches offer quality and versatility for work areas that include network labs, assembly areas, shipping stations, security and command consoles, or as computer repair benches. Can...
These modular work benches offer quality and versatility for work areas that include network labs, assembly areas, shipping stations, security and command consoles, or as computer repair benches. Can...


