December 2006 Issue Print E-mail
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Thursday, 30 November 2006 19:00

December 2006 cover

FEATURES

  • Nickel Stencils
    Improvements in Pb-free Stencils
    When screen printing with Pb-free solder pastes, stencils made from pure nickel or a nickel alloy help to achieve paste transfer efficiency comparable to the levels achieved using SnPb pastes with stainless steel laser-cut stencils. Combined with the efficiencies of a framemounted interchangeable foil stencil system, nickel is the optimal medium for process repeatability and productivity.
    Clive Ashmore and Michael Zahn

  • Placement Software
    New Tools for High-Mix Manufacturers
    Though the speed and accuracy of modern component placement systems still factor greatly in equipment evaluation, software is emerging as a differentiator. Here, a major EMS company discusses how use of new software helped it cut NPI setup by 1.5 to 2 times.
    David Garfield and Steve Bowen

  • Cover Story
    Key Issues in Supporting Customers Not Transitioning To Pb-Free
    Many OEMs need to sustain leaded products for reasons of cost or reliability. This article looks at challenges associated with products that are not transitioning to Pb-free and suggests considerations for both the EMS company and the OEM.
    Curt Williams

  • Case Study
    Finding Hidden Placement Problems
    High-mix, low volume EMS companies spend large amounts of time in machine setup and changeover. Using a special technology that measures machine accuracy, one EMS provider was able to improve its placement machine accuracy.
    Kary Voegele

  • DfM Trends
    Practical Steps to Reduce Total Cost of Ownership
    From R&D to boxbuild, the telecom equipment supply chain is highly complex. Yet many OEMs fail to bring their EMS providers into the process until a new product is ready for volume production. Here’s how to fix that.
    Petra Ebner

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On the cover: How to accomodate OEMs that are sticking with lead solder. (Photo by Gino Santa Maria, 2006)


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Last Updated on Tuesday, 07 February 2012 09:44
 

Columns

Semblant Warms to New Fluoroolymer Conformal Coating

Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week.

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ECTC in Las Vegas

What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here.

This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31.

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Features

The Impact of Reel Splicing Kits on Setup and Changeover

Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way.

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Standard Solar Cells vs. Next-Gen Cells: Which is Winning?

Overcapacity is stalling the rate of improvement, but only for so long.

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GÖPEL Upgrades TOM AOI for Conformal Coatings
TOM system (Teachable Optical Measurement) inline AOI has been enhanced for inspection of conformal coating Maximum PCB size 460 x 400mm. Can be adjusted to specific test requirements. Range of...