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Written by Administrator
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Saturday, 30 September 2006 19:00 |
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FEATURES
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Test and Inspection Evaluating ROI of AXI vs. AOI A model for calculating savings from reduced DPMO against equipment investment costs clearly demonstrates that the economic benefits of either technology depend upon the board complexity, throughput, labor costs, cost of field failures and returns, and equipment performance, as well as capital equipment, programming and operating costs. Keith Fairchild
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Supplier Sourcing Prototype vs. Production Outsourcing When outsourcing PCBs, OEM procurement staff must fully understand the differences and nuances associated with prototype and production manufacturing, regardless of where those services are situated. Zulki Khan
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Board Finishes Pb-Free Hot Air Leveled Solder Coatings A series of tests from wetting balance to copper dissolution show that the most popular Pb-free pastes work better with HAL versus other common finishes. Howard Stevens and Nimal Liyanage, Ph.D.
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Cover Story Simulating Pb-Free Reflow Computational fluid dynamics simulation of the reflow oven makes it possible to design PCBs for Pb-free manufacturing by predicting thermal gradients during solder reflow processing. Sherman Ikemoto and Robin Bornoff
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The Dover Deals 'Confusion and Clarity' As a new owner – Francisco Partners – enters the scene, what's in store for Universal, Vitronics and Unovis? Mike Buetow
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On the cover: Predicting thermal gradients during reflow. (Photo courtesy Flomerics)
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Last Updated on Tuesday, 07 February 2012 09:44 |