October 2006 Issue Print E-mail
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Saturday, 30 September 2006 19:00

October 2006 cover

FEATURES

  • Test and Inspection
    Evaluating ROI of AXI vs. AOI
    A model for calculating savings from reduced DPMO against equipment investment costs clearly demonstrates that the economic benefits of either technology depend upon the board complexity, throughput, labor costs, cost of field failures and returns, and equipment performance, as well as capital equipment, programming and operating costs.
    Keith Fairchild

  • Supplier Sourcing
    Prototype vs. Production Outsourcing
    When outsourcing PCBs, OEM procurement staff must fully understand the differences and nuances associated with prototype and production manufacturing, regardless of where those services are situated.
    Zulki Khan

  • Board Finishes
    Pb-Free Hot Air Leveled Solder Coatings
    A series of tests from wetting balance to copper dissolution show that the most popular Pb-free pastes work better with HAL versus other common finishes.
    Howard Stevens and Nimal Liyanage, Ph.D.

  • Cover Story
    Simulating Pb-Free Reflow
    Computational fluid dynamics simulation of the reflow oven makes it possible to design PCBs for Pb-free manufacturing by predicting thermal gradients during solder reflow processing.
    Sherman Ikemoto and Robin Bornoff

  • The Dover Deals
    'Confusion and Clarity'
    As a new owner – Francisco Partners – enters the scene, what's in store for Universal, Vitronics and Unovis?
    Mike Buetow

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On the cover: Predicting thermal gradients during reflow. (Photo courtesy Flomerics)


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Last Updated on Tuesday, 07 February 2012 09:44
 

Columns

Breaking Paradigms

Multi-generational teams can ensure new technology is properly vetted.

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Packaging Players Face High Stakes

OSATs are facing off with foundries over next-gen packages.

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Features

Why Mexico (Again) Matters

Mid-market providers are responding to OEM desires for more regional approach.

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‘Trekking On’

After a week in San Diego, Las Vegas seemed a strange old world.

A new location, a new lease on life.

Three tepid years in Las Vegas left many observers wondering if, when it came to the IPC Apex Expo trade show, Elvis had left the building.

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Products

Goepel Upgrades Opticon THT AOI
OptiCon THT-Line AOI now can be directly integrated in the production line. Carriers sized up to 620 x 510mm can be fed into the system. PCB inspection area is 540 x 410mm at a component height up to...