April 2006 Issue Print E-mail
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Written by Administrator   
Friday, 31 March 2006 19:00

April 2006 cover

FEATURES

FIRST PERSON

MONEY MATTERS

TECH TALK

DEPARTMENTS

Industry News
Market Watch
Assembly Insider
Nepcon East Product Preview
Ad Index

On the cover: Even as technology pushes to the atomic level, there is room for conventional manufacturing practices. (Mark Evans, 2005)


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Last Updated on Tuesday, 07 February 2012 09:45
 

Columns

Breaking Paradigms

Multi-generational teams can ensure new technology is properly vetted.

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Packaging Players Face High Stakes

OSATs are facing off with foundries over next-gen packages.

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Features

Why Mexico (Again) Matters

Mid-market providers are responding to OEM desires for more regional approach.

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‘Trekking On’

After a week in San Diego, Las Vegas seemed a strange old world.

A new location, a new lease on life.

Three tepid years in Las Vegas left many observers wondering if, when it came to the IPC Apex Expo trade show, Elvis had left the building.

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Products

Goepel Upgrades Opticon THT AOI
OptiCon THT-Line AOI now can be directly integrated in the production line. Carriers sized up to 620 x 510mm can be fed into the system. PCB inspection area is 540 x 410mm at a component height up to...