February 2006 Issue Print E-mail
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Tuesday, 31 January 2006 18:56

February 2006 cover

FEATURES

  • Materials Declaration
    Full Disclosure
    What are your parts made out of? It's not so easy to know.
    Michael Kirschner

  • Pb-Free Printing Parameters
    Understanding Pb-Free Stencil Requirements
    This study of what happens when the process window is intentionally violated finds engineers should worry more about the effects of stencil geometries than a centered Pb-free print process.
    Clive Ashmore

  • Technology Innovations
    Integrating AOI and Selective Soldering
    A breakthrough machine for PTH mass soldering combines AOI and selective soldering in a single inline unit. How it works, and the business case behind it.
    Mark Cannon, Bob Klenke and Phil Zarrow

  • EMS RoHS Models
    Outsourcing RoHS-Compliant Production at a Distance
    How Beyonics tackled the Pb-free transition, and auditing advice for overseas customers.
    Eric Liew, Fadzol Zaman and Sivakumar Thanupillai

  • Supply Chain Solutions
    The Supply Excellence Project at Ericsson and Solectron
    Blending Lean and Agile concepts cut lead times by 75% on a complex, custom telecom product.
    Ylva Andersson, Jan Melin, Rolf Broström, Lindsay Ballantyne, Dave Cooper and Lennart Ivarsson

  • Procurement
    The Future of PCB Procurement
    The battle for supply-chain ownership pits distributors vs. EMS firms.
    Mike Buetow

  • Solder Joint Reliability
    Crack Growth Rate Measurement and Analysis for WLCSP SnAgCu Solder Joints
    Using FEM, cracking is correlated with average inelastic strain and strain energy density.
    Paresh Limaye, Bart Vandevelde, Dirk Vandepitte and Bert Verlinden

  • Pb-Free Wave Soldering
    Dynamics in Pb-Free Wave Soldering
    A five-phase study of fluxes and convection preheating related to three Pb-free alloys revealed a few unexpected twists.
    R.A. Szymanowski, D. Casati, E. Saglia, P. Lotosky, K. Howell and G. Hueste

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On the cover: The influence of aperture designs on Pb-free assembly. (Cover photo courtesy of DEK. Inset courtesy of ERSA.)

Last Updated on Tuesday, 07 February 2012 09:45
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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