January 2006 Issue Print E-mail
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Monday, 02 January 2006 17:16

January 2006 cover

FEATURES

  • Flex Assembly
    Installing Flash LEDs on Flex
    Recommendations on soldering and bending processes when components are mounted on a flex circuit.
    Shereen Lim

  • Pb-Free Soldering Profiles
    Processes and Their Parameters
    Although many important aspects required to establish the “ultimate” profile for wave or reflow soldering have not yet been investigated, several can be used as a starting point.
    Markus Walter

  • Cover Story
    Use of Closed-Loop Process Controls in Dispensing
    Tests show that a two-component epoxy adhesive will change in viscosity over time and cause a direct change in the amount being deposited. Yet a simple weight measurement can be used to calibrate a dispensing process.
    James Klocke

  • Encapsulant Materials
    Low Pressure Molding: A Primer
    Low pressure molding reduces the process steps required by conventional potting techniques and is now in use for complete encapsulation of PCBs.
    Frank Ongkiehong and Steven Dufresne

  • Productronica Recap
    Still the King of Shows
    Three standout products made royal debuts at the world’s largest electronics equipment fair.
    Mike Buetow

  • Pb-Free Rework
    Hand Solder Rework of Pb-Free PTH and SMT Packages
    A study of over 1300 Pb-free components proves Pb-free hand solder rework can be performed reliably. The top variable: Operator experience.
    Alan Donaldson

FIRST PERSON

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TECH TALK

DEPARTMENTS

Industry News
Market Watch
Assembly Insider
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Apex Product Preview
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On the cover: Closed-loop dispensing made easy. (Photo of XyFlex Pro+ courtesy Speedline Technologies)


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Last Updated on Tuesday, 07 February 2012 09:45
 

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