| Zestron Rolls Out Vigon RC 101 |
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| Tuesday, 28 August 2007 12:13 | |||
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Vigon RC 101 is an MPC technology-based cleaning agent for removing baked-on flux residues from reflow ovens and in wave solder processes. Does not have a flash point. Removes lead-free and eutectic flux residues. Said to reduce solder flakes from fingers. Reportedly reduces consumption losses up to 20x. Meets RoHS and WEEE guidelines. Zestron America, www.zestron.com
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| Last Updated on Tuesday, 28 August 2007 12:14 |
Columns
| An Early Spring? |
The second half of 2011 is behind us, literally and figuratively. |
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| ‘An End-to-End Solution for Assembled HDI Rigid-Flex’ |
Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. |
| Read more... |
Features
| SMT Stencils from a Production Perspective |
Is the slew of new materials, coatings and processes truly unique, or just the same old hype? |
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| Implementing Good Test Coverage and Eliminating Escapes |
Experimental data reveal a strong correlation between SPI and AXI. |
| Read more... |
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Polyonics Provides Double-Coated Tapes
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Polyonics double-coated tapes are reportedly ideal for bonding materials that will be exposed to high temperatures and harsh manufacturing environments. Include liners designed to be die cut. Are...
