January 2009 Issue Print E-mail
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Wednesday, 31 December 2008 19:00
January 2009 cover
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FEATURES

  • The Hidden Factory
    Eliminating Muda: One Company’s Journey
    When the Milwaukee Electronics Companies decided to implement Lean manufacturing principles in 2003, its implementation team thought the major benefit would be increased throughput on the manufacturing floor. While those goals were achieved, the most significant lesson learned was the true bottleneck lay in supply-chain management.
    By Don Sivilotti

  • Cover Story
    Selective Wave Soldering DoE to Develop DfM Guidelines for Lead and Pb-Free Assemblies
    The reduced pallet opening size on a selective wave solder pallet hampers the ability to successfully fill PTH barrels, a problem amplified when using Pb-free alloy due to differences in fluid properties. An intensive DoE finds several ways to quantify the impact of design, component spacing and hole-fill criteria in terms of DPMO.
    By Makram Boulos, Craig Hamilton, Mario Moreno, Ramon Mendez, German Soto and Jessica Herrera

  • Test Developments
    Overcoming Limited Access at ICT
    A new novel technology delivers in-circuit test stimulus signals via a boundary scan device, a method said to reduce the number of ICT probes needed to test all the board components – and the ICT system cost, too.
    By Jun Balangue

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On the cover: A DoE offers optimized solder pallet designs for selective soldering. (Photo courtesy Celestica)


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Last Updated on Tuesday, 05 May 2009 06:08
 

Columns

An Early Spring?

The second half of 2011 is behind us, literally and figuratively.

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‘An End-to-End Solution for Assembled HDI Rigid-Flex’

Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology.

MLFEX executive and PCD&F columnist Jay Desai spoke with editor-in-chief Mike Buetow about the new partnership.

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Features

SMT Stencils from a Production Perspective

Is the slew of new materials, coatings and processes truly unique, or just the same old hype?

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Implementing Good Test Coverage and Eliminating Escapes

Experimental data reveal a strong correlation between SPI and AXI.

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Products

Polyonics Provides Double-Coated Tapes
Polyonics double-coated tapes are reportedly ideal for bonding materials that will be exposed to high temperatures and harsh manufacturing environments. Include liners designed to be die cut. Are...