November 2005 Issue Print E-mail
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Monday, 31 October 2005 19:00

November 2005 cover

FEATURES

  • IR Rework
    A Novel IR Rework System
    Lead-free raises the reworked board temperature – and increases risk of frying other parts. Dynamic temperature control and sensors help manage the heat.
    Mark Cannon

  • Cover Story
    Mixed Technology Gets Selective
    Through-hole is still a fundamental processing step – most boards today mix SMT and PTH technology. Selective and fountain soldering can reduce skips and opens over traditional wave processes. Here's a primer.
    Scott Buttars

  • Academic Research
    Program for Calculation of Flip-Chip Standoff Height
    A simple Visual Basic file easily calculates bump heights and predicts flip-chip standoff gaps.
    Joshua Ampofo, Richard LaBennett, S. Akwaboa and Dr. F. Ferguson

  • Pb-Free Transition
    Switching to Pb-Free: Wave Soldering
    How to adjust conveyors, pots, preheaters and solder modules for Pb-free processes.
    Markus Walter

  • AOI
    Zero-Defect IC Inspection
    What role does camera view play in catching potential defects? The advantages and disadvantages of inspections performed with orthogonal and inclined cameras.
    Peter Krippner

  • Backend Processes
    0.1 Cent RFID Chip Assembly?
    While the world argues over the "nickel tag," the pursuit is on for technologies that would slash manufacturing costs.
    Hugo Pristauz

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On the cover: Selective soldering is gaining momentum for PTH processing. (Photo courtesy Juki Automation Systems)


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Columns

European RoHS Enforcement Explained

A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.

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Believing Foxconn Means Suspending Belief

The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down:

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Features

Managing Your ESD Program

The processes are as important as the tools.

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SMT Reflow Oven-to-Oven Repeatability

How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

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Products

Kolb Releases PS300 2HY Stencil Cleaner
PS300 2HY hybrid batch stencil cleaner is suitable for stencils, PCBs, misprints and solder frames. Is an automatic single-chamber system; features 3-4 step PowerSpray cleaning. Is part of compact...