August 2005 Issue Print E-mail
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Sunday, 31 July 2005 19:00

August 2005 cover

FEATURES

  • AOI Pitfalls
    Poor Vision
    The value of inspection is overshadowed by software issues and floor management.
    Matt Holzmann

  • Cover Story
    Pb-Free, Moisture Sensitivity and X-Ray Inspection
    Parts absorb considerably more moisture during lead-free assembly. X-ray can spot the subsequent solder joint problems.
    David Bernard, Ph.D.

  • CAM Automation
    Not-So-Secret Codes
    Never change CAM automation on a Friday, and other lessons of software integration.
    Stephen Potter

  • Component Packaging
    MEMS in Medicine
    How these next-generation components are changing a vital application for electronics.
    Ken Gilleo, Ph.D.

  • Pb-Free Transition
    Converting Wave Soldering Equipment to Pb-Free
    Install a new solder pot in just an hour.
    Lee Whiteman, Jeff Stong and Debbie Alavezos

FIRST PERSON

MONEY MATTERS

TECH TALK

DEPARTMENTS

Assembly Insider
Industry News
Market Watch
Ad Index
ATExpo Product Preview
Nepcon Southeast China Product Preview

On the cover: X-ray's role in lead-free assembly. ( iStockphoto Inc.)

Last Updated on Tuesday, 07 February 2012 09:47
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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Products

Panasonic Debuts PanaCIM Maintenance with Augmented Reality
PanaCIM Maintenance with Augmented Reality software provides instant communication and information to factory technicians -- when and where it is needed -- so they can respond to factory needs more...