March 2010 Issue Print E-mail
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Monday, 01 March 2010 00:00

Circuits Assembly March 2010 cover

FEATURES

  • Cover Story
    Could Printed Electronics Replace Traditional Electronics?
    Over the next 10 years, printed electronics will make gains in RFID, displays, packaging, ICs, and alternative energy. But a glorious future isn't set in stone.
    by Randall Sherman

  • CIRCUITS ASSEMBLY Top 50
    The Trials of 2009
    When it comes time to write the story of the EMS industry in 2009, foremost will be the effects of the recession. The subtext, however, will be the dramatic fall of Elcoteq, whose final chapter is still being written. Plus: The 50 largest EMS companies.
    by Mike Buetow

  • Supply Chain Management
    Ensuring Component Integrity from an EMS Perspective
    Short consumer product lifecycles, the electronics industry’s conversion to lead-free components, and general weakness in the global market have increased the speed at which components are becoming obsolete. And legacy products are prone to fake parts.
    by Dennis Gradler

  • 3-D AOI
    Improving Solder Paste Printing through Phase Shift Interferometry
    New measurement technology enables high degrees of verification and confidence.
    by Chrys Shea

FIRST PERSON

MONEY MATTERS

  • Global Sourcing
    Getting vertical.
    Rex Green

  • ROI
    Merger mania strikes again.
    Peter Bigelow

TECH TALK


DEPARTMENTS

Off the Shelf

Last Updated on Tuesday, 09 March 2010 11:08
 

Columns

An Early Spring?

The second half of 2011 is behind us, literally and figuratively.

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‘An End-to-End Solution for Assembled HDI Rigid-Flex’

Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology.

MLFEX executive and PCD&F columnist Jay Desai spoke with editor-in-chief Mike Buetow about the new partnership.

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Features

SMT Stencils from a Production Perspective

Is the slew of new materials, coatings and processes truly unique, or just the same old hype?

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Implementing Good Test Coverage and Eliminating Escapes

Experimental data reveal a strong correlation between SPI and AXI.

Read more...
 

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Products

Polyonics Provides Double-Coated Tapes
Polyonics double-coated tapes are reportedly ideal for bonding materials that will be exposed to high temperatures and harsh manufacturing environments. Include liners designed to be die cut. Are...