Exhibiting at DesignCon East this week, Tyco and FCI, among others, claimed most interest remains centered in the mid-range, despite talk of high er speed applications.

Booth traffic at the show was very light on Tuesday afternoon.

A few booths away, FCI agreed the industry is still wokring in the 3.125 to 6 Gb/s range. Most applications just don't have the need yet for higher speeds, they said.

Other show notes:

Endicott Interconnect Technologies was displaying its Hyper-Z BGA package. The package holds four CSPs, and has nine metal layers (five power/ground and four signal planes), 0.001" lines/spaces, all on a Teflon substrate. 

Teradyne has put in an ENIG process, and launched a five-person development group for its PCB fabrication business, a first for the company.