| IPC, Soldertec Host International Pb-Free Conference |
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| Written by Robin Norvell | |||
| Wednesday, 20 April 2005 06:29 | |||
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Bannockburn, IL - As the electronics industry races to meet the EU's RoHS Directive, IPC and Soldertec Global --a division of Tin Technology-- are sponsoring the third International Conference on Lead-Free Electronics on June 7-10 in Barcelona. Critical lead-free issues include new alloys and materials evaluations, inspection changes, tin whiskers, lead-free on advanced packages like chip scale and flip chip, and reliability. Assembly operations will face increased assembly costs (perhaps 15% higher) and will impact areas beyond manufacturing such as field support, sales, marketing and training.Conference topics and educational courses will cover: Policy development: European/Asian/other legislation or voluntary activity on hazardous materials and recycling; Legislative compliance and policy enforcement methods; Supply chain issues: Standards for marking and test; Materials declarations, part number, obsolescence, etc.; Production issues: Design for lead free production; Component solder, board development, availability and lead-free compatibility; Examples of implementation; Reflow, wave, hand soldering, inspection, repair, rework and test;Cost issues: Tin whiskers; Reliability test data and method developments; High reliability product sectors (automotive, aerospace, etc.) Environmental considerations: Toxicity and risk; Recycling; Substitutes for other hazardous substances.
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| Last Updated on Wednesday, 20 April 2005 16:53 |
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