Workshop Addresses High Temp. Challenges Print E-mail
User Rating: / 0
PoorBest 
Written by Robin Norvell   
Wednesday, 20 April 2005 06:18
Minneapolis -- The Harsh Environment Electronics Workshop cosponsored by SMTA and Auburn University will be held June 28-29 in Indianapolis. The workshop will address concerns related to harsh environment electronics and challenges for auto electronics. It aims to combine the needs of end-users with the capabilities from  research and industry.
 
Will addresses the challenges of meeting expanding temperature ranges (-55°C to +150°/200°C) with increased vibration, higher packaging density and longer reliability. Next-generation requirements for automotive electronics are explored from the systems level and potential supply based solutions are presented.
 
Industrial needs for non-automotive vehicle requirements will be addressed, with session topics on:
- Thermal Interface Materials
- Component Reliability
- Module Overmolding
- Systems Design
- Lead-Free Soldering and Solder Alternatives
 
The workshop will also feature a panel discussion on lead-free for harsh applications.  
 

blog comments powered by Disqus
Last Updated on Wednesday, 20 April 2005 16:53
 

Columns

Breaking Paradigms

Multi-generational teams can ensure new technology is properly vetted.

Read more...
 
Packaging Players Face High Stakes

OSATs are facing off with foundries over next-gen packages.

Read more...
 

Features

Why Mexico (Again) Matters

Mid-market providers are responding to OEM desires for more regional approach.

Read more...
 
‘Trekking On’

After a week in San Diego, Las Vegas seemed a strange old world.

A new location, a new lease on life.

Three tepid years in Las Vegas left many observers wondering if, when it came to the IPC Apex Expo trade show, Elvis had left the building.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Fujipoly Debuts Sarcon 25GR-T2d
Sarcon 25GR-T2d conformable thermal interface medium is for low and high-volume production applications. The reinforced 0.25mm thick TIM is for tight tolerance die-cut operations. When placed between...