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Written by Robin Norvell
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Monday, 18 April 2005 06:02 |
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Tokyo -- The 35th International Electronic Circuits Expo will take place June 1-3 at the Tokyo Big Sight center. The show, sponsored by JPCA (Japan Printed Circuit Association) -- a member of the WECC (World Electronic Circuits Council) -- will focus on "The Challenge, Starting for the Next Evolution." The show is offered in conjunction with the JIEP (Japan Institute of Electronics Packaging) 2005 Microelectronics Show: "Discover the Next Generation Technologies on Electronics Packaging." The two shows will feature 530 exhibiting companies with 1,531 booths, and the producers expect more than 100,000 global attendees during the three-day period. Participants can attend three keynote sessions: professor Dr. Kenichi Ohmae of UCLA will address "The Next Global Stage - Challenges and Opportunities in our Borderless World;" Dr. Takeo Nakagawa, CEO of Fine Tech Corp., will talk about strategies for the future of manufacturing in Japan; and Dr. Tsugio Makimto, Sony's corporate advisor will address the role of electronics packaging in the paradigm shift era of electronics industry. The concurrent Jisso (Advanced Electronics Packaging) Technology Symposium will offer technological sessions such as SiP/Multi Chip Package, Thin Wafer/Chip Packaging, High Frequency Packaging/New Substrate Materials, FPC, MEMS, Embedded Packaging Board and Opto-electronics Packaging technologies on the topics. Click here for early registration.
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