| Young Jin Features Link Conveyors |
 |
 |
| Written by Chelsey Drysdale | |||
| Thursday, 02 July 2009 15:41 | |||
|
Link conveyors for SPI NG/good buffer are designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission. Has RS-232C interface with SPI and NG PCB anti-touch verification. Is said to provide increased line efficiency and requires minimal space. No need to filter NG PCBs, and SPI operates normally, even during NG PCB verification. AOI NG Buffer stacks NG PCBs and pushes good PCBs to the next AOI inspection process. Features a PCB shock-free and noncontact power transmission. Both systems feature a SMEMA interface, a slim, round design, adjustable stacking, a LED tower light and touch-screen operation.
|
Columns
| An Early Spring? |
The second half of 2011 is behind us, literally and figuratively. |
| Read more... |
| ‘An End-to-End Solution for Assembled HDI Rigid-Flex’ |
Multi-Fineline Electronix (MFLEX) and AT&S last week announced an agreement to share their respective printed circuit board technologies. Under the agreement, AT&S's high-density interconnect (HDI) rigid PCBs and MFLEX's flex board capabilities will be offered to respective customers, and the two will partner on rigid-flex technology. |
| Read more... |
Features
| SMT Stencils from a Production Perspective |
Is the slew of new materials, coatings and processes truly unique, or just the same old hype? |
| Read more... |
| Implementing Good Test Coverage and Eliminating Escapes |
Experimental data reveal a strong correlation between SPI and AXI. |
| Read more... |
Search
Search
Login
CB Login
Language
Language
Products
Polyonics double-coated tapes are reportedly ideal for bonding materials that will be exposed to high temperatures and harsh manufacturing environments. Include liners designed to be die cut. Are...
