| DDM Novastar Debuts ERO-500 Reflow Oven |
| Written by Mike Buetow | |||
| Monday, 11 February 2013 09:18 | |||
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ERO-500 reflow oven has five top and five bottom vertical heating zones, and one cooling zone. Uses plenum convection heating for uniform temperature profiling across the entire printed circuit board. Maximum temperature of 320°C. Compatible with most lead and lead-free solder paste profiles. For low- to medium-volume production runs. Status light tower included. Mesh belt or edge rail conveyor units available. Real-time graphic temperature profiler. DDM Novastar, ddmnovastar.com
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Columns
| Semblant Warms to New Fluoropolymer Conformal Coating |
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Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week. |
| Read more... |
| ECTC in Las Vegas |
What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here. This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31. |
| Read more... |
Features
| The Impact of Reel Splicing Kits on Setup and Changeover |
Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way. |
| Read more... |
| Standard Solar Cells vs. Next-Gen Cells: Which is Winning? |
Overcapacity is stalling the rate of improvement, but only for so long. |
| Read more... |
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